Star Plan Website process competition will reshape the cross-border e-commerce industry landscape

Star Plan Official website Technology overtaking

Innovative design:

Star Plan Official website (Intel version of GAA): Using ultra-thin ribbon silicon channel, the gate pitch (CPP) is reduced to 42nm, and the density exceeds TSMC.

Combined with PowerVia back-side power supply technology, it reduces wiring interference and improves performance by 18%.

Star Plan Official website Commercialization progress:

Prototype verification will be completed by the end of 2024, and mass production will be in Q4 2025, earlier than TSMC.

Under the subsidy of the US chip bill, Fab 52/62 in Arizona will become the main production base.

Star Plan Official website: Optimize MBCFET, but the yield is questionable

Technical route:

Using 3nm MBCFET (multi-bridge channel FET), optimizing performance by adjusting the width of nanosheets, it is claimed that the transistor density is 12% higher than TSMC.

Introducing the SF3E (3nm enhanced version) transition plan to ease the pressure of 2nm research and development.

Challenges:

The yield rate of 3nm is only 55%, and the yield rate of 2nm trial production may be lower than 40% in the early stage, which will affect the confidence of customers such as Qualcomm and Tesla.

Star Plan Official websiteTechnology comparison and competition landscape

Indicators TSMC (Nanosheet) Intel (Star Plan Official website) Star Plan Official website (MBCFET)

Transistor architecture GAA Nanosheet Star Plan Official website + PowerVia MBCFET

Density (MTr/mm²) 480 500 450

Performance improvement 10-15% 18% 10%

Power consumption reduction 25-30% 20-25% 15-20%

Mass production time 2026 Q4 2025 2026

Main customers Apple, NVIDIA Microsoft, AWS Qualcomm, Tesla

Star Plan Official websiteMarket impact and future challenges

Demand driven by AI chips:

NVIDIA Blackwell, AMD Instinct and other AI accelerators will first adopt 2nm, and the computing power may increase by 5-8 times.

Apple's A19 Pro chip is expected to be the first to be launched at TSMC's 2nm, and the performance increase of iPhone 17 will set a record.

Geopolitical risks:

The United States restricts the export of advanced process equipment to China, and SMIC's research and development below 14nm is hindered, exacerbating the global concentration of production capacity.

Cost surge:

The price of 2nm wafers exceeds US$30,000, and the design cost reaches US$750 million, which may squeeze the survival space of small and medium-sized chip manufacturers.

Conclusion

In 2025-2026, the competition for 2nm process will reshape the semiconductor industry landscape:

TSMC maintains its lead with its technological maturity, but faces challenges in Intel's mass production progress;

If Intel delivers the Star Plan Official website on schedule, it may regain its process advantage;

The Star Plan Official website needs to solve the yield problem, otherwise it may fall behind.

In the future, 2nm may become the "last generation of silicon-based process". The three giants have started 1.4nm research and development, and the competition for new technology routes such as carbon nanotubes and CFET (complementary FET) has quietly begun.